Thermal Computer to Plate System (CTP)

  • Thermal Computer to Plate System (CTP)
  • Thermal Computer to Plate System (CTP)
Thermal Computer to Plate System (CTP)

Main specifications:

Model

KX830T-I

KX830T-II

KX830U-I

KX830U-II

Laser system

830nm LD,32channels

830nm LD,48channels

405nm LD,32channels

405nm LD,48channels

Resolution

2400dpi

Output speed

15p/h(745mm×605mm)

25p/h(745mm×605mm)

15p/h(745mm×605mm)

25p/h(745mm×605mm)

Exposure structure

External drum

Plate size

Max. 830mm×660mm; Min.450mm×340mm

Plate thickness

Thermal (830nm)0.15~0.4mm

UV (405nm) 0.15~0.4mm

Max hanged line

300lpi

FM dots output

15μ m

Repeatability

±0.01mm

Power supply

AC 220V AC/50Hz-60Hz 6KWN (Single phase)

External dimension

L × W × H =1950mm × 1120mm × 1130mm   1200kg

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